Tongling Trinity Jianxi Precision Industry Co., Ltd.
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Tongling Zonfa Trinity Technology Co., Ltd.
🇨🇳 China
19961001-2000 peopleManufacturer/Trading Company
High capacity factory
Established brand
Large enterprise group
OEM manufacturer
Shipments
120
Key customer
ADOPEN
Key market
🇺🇸 United States
Description
Tongling Zonfa Trinity Technology Co., Ltd. is a prominent manufacturer and exporter based in Tongling, Anhui Province, China. Established in 2000 and rooted in military industrial plants from the 1960s, the company is a key subsidiary of the Trinity Group (stock code: 600520). With a workforce of approximately 1,800 employees and a strong focus on research and development, the company specializes in high-precision engineering solutions for the semiconductor, construction, and industrial machinery sectors.
Extrusion Tooling/Mould
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Tongling Yuanyi Precision Machinery Co., Ltd.
🇨🇳 China
200951-100 peopleManufacturer/Trading Company
High-tech enterprise
Patented technology
Product customization
Low MOQ
Description
Tongling Yuanyi Precision Machinery Co., Ltd. is a national high-tech manufacturer and trading company based in Tongling, Anhui Province, China. Established in 2009, the company operates a 5,000-square-meter facility and employs between 51 and 100 professionals. Specializing in the semiconductor and integrated circuit packaging industry, the firm has over 15 years of expertise in the research, development, and manufacturing of high-end precision molds and automated equipment components. Their core product portfolio includes IC packaging molds, cavity bars, pot and plunger systems, conversion kits, and trim and form dies, supporting various packaging forms such as QFN, BGA, SOT, TO, and DIP. Utilizing advanced CNC machining and BCAD/CAPP/CAM technology, the company achieves remarkable precision levels of up to ±0.001mm and surface roughness as low as Ra0.02μm. Tongling Yuanyi is recognized as a municipal-level 'specialized, refined, special and new' enterprise and maintains ISO 9001:2015 certification for its quality management systems. The company serves the global semiconductor packaging, testing, optical communication, and SMT industries, positioning itself as a strategic partner for high-end manufacturing sectors including 5G communication and artificial intelligence.
High Precison Mold for IC Packaging with ISO9001: 2015
High Quality Pot for IC Package in Semiconductor with ISO9001: 2015
High Precision Top Cavity Block for IC Package with ISO9001: 2015