Deep Etch Semicon Group Co., Ltd
Deep Etch Semicon Group Co., Ltd
🇨🇳 China, Guangdong
201911-50 peopleManufacturer/Service CompanyDeep Etch Semicon Group Co., Ltd, established in 2019 in Shenzhen, China, is a high-tech enterprise specializing in the R&D, design, manufacturing, and sales of semiconductor products. The company operates as a contract manufacturer and aims to be a global leader in semiconductor solutions. With 11 to 50 employees, Deep Etch Semicon Group focuses on high-end application markets, offering a comprehensive range of products across the entire semiconductor industry chain. Their core offerings include third-generation semiconductor materials, wafer manufacturing, packaging, and testing. They provide various wafer raw materials such as monocrystalline silicon, polysilicon, epitaxial silicon, compound semiconductor wafers (GaAs, InP, GaN, SiC), and oxide semiconductor wafers (ZnO, ITO). The company also specializes in substrate materials (ceramic, inorganic, metal, organic), ceramic packages (CDIP, Butterfly Package, CQFP, CPGA, CSOP, CLCC, CBGA, SOP, DIP, QFP), and IC packaging substrates (FCBGA, FCCSP, SAP, mSAP, Tenting, Coreless processes). Additionally, they supply a wide array of semiconductor equipment, including lithography, etching, deposition, microscopy, sputtering, evaporation, dicing, plasma, probe stations, testing, electroplating, furnaces, polishing, thinning, Raman, and bonder machines. Deep Etch Semicon Group also offers sensor chip series and customizable sensor solutions. The company is certified with CE, ISO 9001, ISO 14001, IATF 16949, and FCC, demonstrating its commitment to quality and international standards. They operate a factory and are recognized for their technological innovation and process optimization.
ODM manufacturerProvides ODM design and manufacturing solutions.
Low MOQOffers low minimum order quantity options.
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CE1
ISO 90011
ISO 140011
IATF 169491
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