Streuter Fastel Timtel
Streuter Fastel Timtel
🇺🇸 United States, California
200551-100 peopleManufacturer/Service CompanyStreuter Fastel Timtel, also known as Streuter Technologies, Inc., is an ISO 9001:2015 certified manufacturer and service company based in San Clemente, California, USA. Established in 2005, the company specializes in advanced adhesive and thermal interface material technologies, operating under its strategic global brands, FASTEL and TIMTEL. With 51 to 100 employees and annual revenues between $5-9.9 million, Streuter Fastel Timtel develops and manufactures a comprehensive range of products including Phase Change Materials, Thermally Conductive Films, Thermally Conductive Gap Pads, Heat Spreading Materials, Thermal Bonding Films, Heat/Induction Seal Foils, Electrically Conductive Adhesive Films, and Pressure Sensitive Adhesives. These solutions are designed to address global power density demands within smaller device footprints and cater to diverse applications in electronics, automotive, industrial, and medical device/diagnostic sectors. The company offers both processed materials and contract manufacturing services, including OEM and ODM capabilities. Streuter Fastel Timtel also provides extensive converting services such as prototyping, die-cut converting, and material substrates, aiming to simplify the supply chain for its worldwide customer base. Their facilities are equipped with strategic manufacturing, process machinery, test equipment, and development capabilities, enabling in-house filming/coating and the development of proprietary adhesive and thermal compound formulations. Notable products include UltraPhase 60, EMI-PHASE 60, M45 Phase Change Film, and FastelFilm HPB-600-PT, with several products holding UL94-VO and USP Class VI certifications.
Product customizationOffers full customization for design and features.
Established brandFounded in 2005, with over 20 years of industry experience.
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UltraPhase 60
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Substrate: Kapton MT+ (plus) Polyimide60C Phase Change TemperatureThickness: 0.064mm to 0.076mmIntraGraph PCM
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Substrate: IntraGraph HS Film In-Plane: 140 W/m-K Thru-Plane: 8.0 W/m-K 50C Phase Change Temperature Thickness: 0.15mm to 0.30mm Non-Dielectric Pad SolutionGraphenol PCM
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Substrate: Graphenol HS (pyrolytic)In-Plane: 1,500 W/m-K Thru-Plane: 5.0 W/m-K 50C Phase Change Temperature Thickness: 0.057mm to 0.095mmNon-Dielectric Pad SolutionSilverPhase 50
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Substrate: Aluminum Foil50C Phase Change TemperatureThickness: 0.076mm to 0.13mm Electrically Conductive Material Volume Resistivity: 2.0 ohm-cmXoPhase 45 PCM Film
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Thermal Conductivity: 3.0 W/m-K 45C Phase Change Temperature Film Thickness: 0.13mm to 0.30mm Free Standing Phase Change FilmM45 PCM Film
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Thermal Conductivity: 5.0 W/m-K45C Phase Change TemperatureFilm Thickness: 0.15mm to 0.30mm Free Standing Phase Change FilmActaPhase 60
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Substrate: Aluminum Foil 60C Phase Change Temperature Thickness: 0.051mm to 0.23mmIntraPhase 60
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Substrate: Aluminum Foil 60C Phase Change Temperature Thickness: 0.051mm to 0.18mmIntraPhase 50
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Substrate: Aluminum Foil50C Phase Change TemperatureThickness: 0.051mm to 0.18mmDiaPhase 60A (Tack Back)
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Substrate: Kapton MT Polyimide 60C Phase Change Temperature Thickness: 0.051mm to 0.14mmDiaPhase 60
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Substrate: Kapton MT Polyimide 60C Phase Change Temperature Thickness: 0.051mm to 0.18mmlinkedin
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ISO 900110
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