Suzhou Bozhon Semiconductor Co., Ltd
Suzhou Bozhon Semiconductor Co., Ltd
🇨🇳 China, Jiangsu
200151-100 peopleManufacturerSuzhou Bozhon Semiconductor Co., Ltd. is a manufacturer and contract manufacturer based in Suzhou, China, established in 2001. As a subsidiary of Bozhon Precision Technology Co., Ltd. (stock code: 688097), the company leverages over 20 years of technological expertise in intelligent manufacturing. With 51 to 100 employees and a production base covering 400,000 m, Suzhou Bozhon Semiconductor specializes in advanced semiconductor manufacturing equipment. Their core product lines include high-speed, high-precision epoxy die bonders (FastStar Series), fully automatic high-precision eutectic die bonding machines (MicroStar Series), and AOI inspection machines (CesiStar Series). These products are critical for applications in photonics, laser, power semiconductors, microwave radio frequency, and semiconductor inspection, serving industries such as consumer electronics, new energy vehicles, and critical components. The company holds ISO 9001 certification and boasts a significant R&D presence with 1583 engineers across the parent company, holding numerous intellectual property items. They are committed to promoting advanced processes and industrial upgrades in the semiconductor industry through continuous R&D and product innovation, offering both individual machines and comprehensive turn-key solutions to domestic and international clients.
Own brandOwns and operates its own brands and manufacturing facilities.
Product customizationOffers full customization for design and features.
Patented technologyHolds multiple product or process patents.
Industry association memberMember of ISO 9001 association.
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Advanced Packaging Technologies Epoxy Die Attach Machine with High Customizable
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Advanced Packaging Technologies Epoxy Die Attach Machine with High Customizable, Find Details and Price about High Precision Die Bonder from Advanced Packaging Technologies Epoxy Die Attach Machine with High Customizable - Suzhou Bozhon Semiconductor Co., Ltd$100000
High Precision Chip Bonding Equipment Applied in The Field of Optical Communication
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High Precision Chip Bonding Equipment Applied in The Field of Optical Communication, Find Details and Price about Die Bonding Die Bonder from High Precision Chip Bonding Equipment Applied in The Field of Optical Communication - Suzhou Bozhon Semiconductor Co., Ltd$250000
High Efficiency High Flexibility Eutectic Machine
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High Efficiency High Flexibility Eutectic Machine, Find Details and Price about Die Bonder Die Bonding from High Efficiency High Flexibility Eutectic Machine - Suzhou Bozhon Semiconductor Co., Ltd$100000
Testing Machine for Chip Appearance Defect Detection Aoi Machine
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Testing Machine for Chip Appearance Defect Detection Aoi Machine, Find Details and Price about Aoi Inspection Equipment Inspection from Testing Machine for Chip Appearance Defect Detection Aoi Machine - Suzhou Bozhon Semiconductor Co., Ltd$100000
Domestic Solid Crystal Inverted Multi Chip Packaging Multi Functional Integrated Machine Equipment
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Domestic Solid Crystal Inverted Multi Chip Packaging Multi Functional Integrated Machine Equipment, Find Details and Price about Die Bonder Die Attach from Domestic Solid Crystal Inverted Multi Chip Packaging Multi Functional Integrated Machine Equipment - Suzhou Bozhon Semiconductor Co., Ltd$100000
Supply Automatic High Precision Equipment
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Supply Automatic High Precision Equipment, Find Details and Price about Die Bonding Die Bonder from Supply Automatic High Precision Equipment - Suzhou Bozhon Semiconductor Co., Ltd$250000
Domestic High-Precision Solidification Machine Supports Epoxy Resin, Welding, and Hot Pressing
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Domestic High-Precision Solidification Machine Supports Epoxy Resin, Welding, and Hot Pressing, Find Details and Price about Die Bonder Die Bonding from Domestic High-Precision Solidification Machine Supports Epoxy Resin, Welding, and Hot Pressing - Suzhou Bozhon Semiconductor Co., Ltd$100000
Domestic High-Precision Die Attach Machines Have a Wide Range of Application Products
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Domestic High-Precision Die Attach Machines Have a Wide Range of Application Products, Find Details and Price about Die Bonder Die Bonding from Domestic High-Precision Die Attach Machines Have a Wide Range of Application Products - Suzhou Bozhon Semiconductor Co., Ltd$100000
High Precision Dispensing Equipment for Semiconductor Packaging Solutions
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High Precision Dispensing Equipment for Semiconductor Packaging Solutions, Find Details and Price about Die Bonding Die Bonder from High Precision Dispensing Equipment for Semiconductor Packaging Solutions - Suzhou Bozhon Semiconductor Co., Ltd$250000
Domestic High-Precision Eutectic Machine with High Flexibility and Easy Expansion
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Domestic High-Precision Eutectic Machine with High Flexibility and Easy Expansion, Find Details and Price about Die Bonder Die Bonding from Domestic High-Precision Eutectic Machine with High Flexibility and Easy Expansion - Suzhou Bozhon Semiconductor Co., Ltd$100000
High Precision Eutectic Machine Products Are Widely Used
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High Precision Eutectic Machine Products Are Widely Used, Find Details and Price about Die Bonder Die Attach from High Precision Eutectic Machine Products Are Widely Used - Suzhou Bozhon Semiconductor Co., Ltd$100000
Multi Functional Eutectic Machine, Suitable for Multi Chip One Machine Production
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Multi Functional Eutectic Machine, Suitable for Multi Chip One Machine Production, Find Details and Price about Die Bonder Die Bonding from Multi Functional Eutectic Machine, Suitable for Multi Chip One Machine Production - Suzhou Bozhon Semiconductor Co., Ltd$100000Customers
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